(DE) +49 (0) 6436 949 138-0 | (KR) +82-2-897-0339 | (US) +1 408-725-7143 | (CN) +86 0769 8906 6900

Underfill Materials

Underfill Materials
Product
Typical Property & Application
Chemical Base
Components
Appearance
Viscosity [mPa·s]
Curing Method
Hardness
Service Temperature
Shear Strength [N/mm²]
EW 6064
Underfill of CSP&BGA for the protection against mechanical stress and thermal shock. Reworkable.
Epoxy
1K
Black
370
Thermal
Shore D: 85
-40 to 150°C
7 (FR4/FR4)
EW 6066
Underfill of CSP&BGA for the protection against mechanical stress and thermal shock.
Epoxy
1K
Black
370
Thermal
Shore D: 85
-40 to 150°C
12 (FR4/FR4)
EW 6360
Underfill of Flip Chip for the protection against mechanical stress and thermal shock.
Epoxy
1K
Black
6,500
Thermal
Shore D: 90
-40 to 180°C
10 (FR4/FR4)