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Epoxies (1K)

1K Epoxy
Product
Typical Property & Application
Chemical Base
Components
Appearance
Viscosity [mPa·s]
Curing Method
Hardness
Service Temperature
Shear Strength [N/mm²]
Resistivity [Ω·cm]

EW 6105
SMD adhesive, high viscosity, thixotropic
Epoxy
1K
Black
250000 – 300000
150°C / 60min or 180°C / 10min
Shore D: 85
-30° to 180°C
370
4,5*1015

EW 6120
SMD adhesive, thixotropic, excellent bonding strength
Epoxy
1K
Red
35000 – 55000
100°C / 10min
Shore D: 80
-30° to 180°C
350
4,5*1015

EW 6122
SMD adhesive, thixotropic, excellent bonding strength
Epoxy
1K
Red
28000 – 50000
150°C / 40min or 180°C / 8min
Shore D:85
-30° to 180°C
370
4,5*1015

EW 6125
SMD, glob top, casting, sealing
Epoxy
1K
Red
500000 – 550000
120°C / 100min
Shore D: 90
-30° to 180°C
385
4,5*1015

EW 6130
Sealing
Epoxy
1K
Black
15000 – 20000
150°C / 120min
Shore D: 85
-30° to 180°C
350
4,5*1015

EW 6106
Potting electronic components
Epoxy
1K
Black
500 – 1000
130°C / 10min
Shore D: 80
-30° to 180°C
210
4,5*1014

EW 6110
Potting ( reworkable )
Epoxy
1K
Black
1500 – 2000
80°C / 30min or 120°C / 5min
Shore D: 85
-30° to 180°C
225
6,0*1013

EW 6115
Plastic sealing
Epoxy
1K
Black
30000 – 50000
120°C / 40min
Shore D:85
-30° to 180°C
340
4,5*1014

EW 6100
Chip Scale Package (CSP) underfill
Epoxy
1K
Black
28000 – 35000
150°C / 40min
Shore D:85
-30° to 180°C
280
4,5*1014

EW 6102
Chip Scale Package (CSP) underfill
Epoxy
1K
Black
25000 – 30000
150°C / 20min
Shore D: 90
-30° to 180°C
300
4,5*1014

EW 6301
Low temperature curing, used in PA/ glass/metal bonding
Epoxy
1K
Black
n.a.
30min@80℃
80
n.a.
15
n.a.

EW 6307
High bonding strength, used in nickel-plated copper bonding
Epoxy
1K
Black
n.a.
15min@170℃
80
n.a.
22
n.a.

EW 6308
High Tg, high bonding strength, used in gold bonding, Pin protection, resistance to Pb-free reflow
Epoxy
1K
Off-white
n.a.
30min@150℃
90
n.a.
25
n.a.

EW 6312
Low temperature curing, high bonding strength, used in PA /glass /metal bonding
Epoxy
1K
Slight yellow
n.a.
30min@80℃
80
n.a.
21
n.a.

EW 6320
Component reinforcement, PI bonding
Epoxy
1K
Black
n.a.
10min@130℃
75
n.a.
25
n.a.

EW 6335
Low viscosity, coating or bonding
Epoxy
1K
Blue
n.a.
UV; 3000 [mJ/cm2]
50
n.a.
14
n.a.

EW 6336
Fast curing, high thixotropic, used in component protection
Epoxy
1K
Blue
n.a.
UV; 3000 [mJ/cm2] + 20min@100℃
75
n.a.
18
n.a.

EW 6339
Low shrinkage, optical transparent, used in optical bonding, potting,
Epoxy
1K
Transperant
n.a.
UV; 3000 [mJ/cm2] + 30min@90 ℃
75
n.a.
12
n.a.

EW 6340
High Tg, low CTE, resistance to Pb-free reflow
Epoxy
1K
White
n.a.
10min@150℃
90
n.a.
18
n.a.